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    歡迎來到氣派科技官方網站 !
    股票代碼:688216

    圓片厚度規則

    Wafer Thickness Rule

    圓片厚度如不在氣派規格內必須將圓片減薄

    Back grinding is required if the thickness exceeds CPC spec.


    產品種類 

    Product Kind 

    封裝形式PKG. Type 

    圓片厚度Wafer thickness

    DIP/HDIP

    DIP7/8/10/14/16/18/20

    10~16.8 mil (250~420 um)

    HDIP12

    Qipai

    Qipai8/16

    10~12.6 mil (250~350 um)

     SOP8

    SOP7/8/14/16

    10~12.6 mil (250~350 um)

    SOP20/24/28

    0.635 SSOP20/24

    0.65 SSOP16/20/24/28

    1.0 SSOP24

    HSOP

    HSOP28

    10~12.6 mil (250~350 um)

    ESOP

    ESOP8/16

    7~11 mil (180~280 um)

    MSOP/EMSOP

    MSOP8/10

    EMSOP8/10

    TSSOP

    TSSOP8

    7~8.6 mil (180~220 um)

    SOT

    SOT23(Small)

    6.7~8.3 mil (170~210 um)

    SOT23-3/5/6

    SOT223

    9.5~13.4mil (240~340 um)

    SOT89-3/5

    LQFP

    LQFP32/48/64

    8~10 mil (200~250 um)

    TSOT

    TSOT23-3/5/6

    5~7 mil (130~180um)

    QFN/DFN

    QFN3X3/4X4/5X5/6X6/7X7

    7~8.6 mil (180~220 um)

    DFN2X2/2X3/3X3/4X4/5X5

    5~7 mil (130~180um)

    DFN1006-2/3

    TO

    TO252

    11~13.4 mil (280~340 um)

    CPC

    CPC4/5/8/14/16/20/24

    6.7~8.3 mil (170~210 um)

    ECPC

    ECPC14/16/20/24

    6.7~8.3 mil (170~210 um)



     



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