<wbr id="prl3k"></wbr>
    <nav id="prl3k"></nav>
  • <button id="prl3k"><legend id="prl3k"></legend></button>
    <form id="prl3k"><tr id="prl3k"><noscript id="prl3k"></noscript></tr></form>
    1. <center id="prl3k"><listing id="prl3k"></listing></center>
      <nav id="prl3k"><listing id="prl3k"></listing></nav>
      <nav id="prl3k"></nav>
    2. 歡迎來到氣派科技官方網站 !
      股票代碼:688216

      圓片厚度規則

      Wafer Thickness Rule

      圓片厚度如不在氣派規格內必須將圓片減薄

      Back grinding is required if the thickness exceeds CPC spec.


      產品種類 

      Product Kind 

      封裝形式PKG. Type 

      圓片厚度Wafer thickness

      DIP/HDIP

      DIP7/8/10/14/16/18/20

      10~16.8 mil (250~420 um)

      HDIP12

      Qipai

      Qipai8/16

      10~12.6 mil (250~350 um)

       SOP8

      SOP7/8/14/16

      10~12.6 mil (250~350 um)

      SOP20/24/28

      0.635 SSOP20/24

      0.65 SSOP16/20/24/28

      1.0 SSOP24

      HSOP

      HSOP28

      10~12.6 mil (250~350 um)

      ESOP

      ESOP8/16

      7~11 mil (180~280 um)

      MSOP/EMSOP

      MSOP8/10

      EMSOP8/10

      TSSOP

      TSSOP8

      7~8.6 mil (180~220 um)

      SOT

      SOT23(Small)

      6.7~8.3 mil (170~210 um)

      SOT23-3/5/6

      SOT223

      9.5~13.4mil (240~340 um)

      SOT89-3/5

      LQFP

      LQFP32/48/64

      8~10 mil (200~250 um)

      TSOT

      TSOT23-3/5/6

      5~7 mil (130~180um)

      QFN/DFN

      QFN3X3/4X4/5X5/6X6/7X7

      7~8.6 mil (180~220 um)

      DFN2X2/2X3/3X3/4X4/5X5

      5~7 mil (130~180um)

      DFN1006-2/3

      TO

      TO252

      11~13.4 mil (280~340 um)

      CPC

      CPC4/5/8/14/16/20/24

      6.7~8.3 mil (170~210 um)

      ECPC

      ECPC14/16/20/24

      6.7~8.3 mil (170~210 um)



       



      玩弄丰满奶水的女邻居,青青草原国产av福利网站,有人有在线观看片资源吗www,亚洲av永久无码精品国产精品